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grinder attachment on the MAHO CNC milling machine shown in Figure 111 to surface grind IC silicon chips The close-up view of the machining set-up for the grinding of small areas on silicon is shown in Figure 112 After the main spindle of the 3-axis MAHO CNC vertical-spindle milling machine is made to stop, the ultra-precision high-speed jig grinder (NSK PLANET 1500) is attached onto the machine s main spindle and air is supplied to the air motor from an air supply kit The air supply is maintained at 4 kgf/cm2 (04 MPa), giving 100,000 10% rpm, based on the speed tests conducted using a non-contact digital tachometer The machining makes it possible to obtain a good quality surface finish with a Ra value as low as 100 nanometers

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Copper Stock with 5 ml/l Carrier - 60 ppm ClAddition of 0.5 ml/l Brightener Addition of 1 ml/l Brightener Addition of 5 ml/l Brightener

Current (mA)

-0 .05

-0 .1

-0 .15

Fig 112: The close-up view of the machining set-up used for the precision grinding of IC silicon chips [9]

-0 .2

The prototype board is not much of a design. The circuit consists of a crystal oscillator, which I have set to 3.58 MHz, a MAX232 chip for RS-232 data translation, and an ISP programming header for serial programming of the AVR chips. A manual reset circuit is

-0. 5 2

-0 .3

0 -0 .35

Using the same machining set-up as in Figure 112, it has been possible to precision grind Pyrex glass [10] (Figure 113) and BK-7 glass [11] (Figure 114) The machining operations have generated good quality surface finishes

Potential (Volt)

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Step 1: For the Basic of RDLS report follow this link: Create RDLC report. Step 2: Download the bar code font 3 of 9 from this site: Barcode Font.

Basically, the brightener increases the current and reduces the suppression. The brightener plays a key role in determining the physical properties of the deposit. It is a grain refiner and, as such, it has a direct enhancing effect on the physical properties of the deposit, such as tensile strength and percent elongation. 29.5.6 Levelers Levelers are used to offset localized high-current-density areas that result from high points or sharp edges in the plating surface. An example would be the dog-bone effect, occasionally seen at the knee of the hole. Levelers are a class of compounds, typically aromatic, that adsorb preferentially at high points in the plating topography due to the increased mass transport possible at these sites. The adsorption of the leveler at these sights creates localized suppression, allowing plating in the lower-current-density areas to catch up with high areas hence, the leveling effect.

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Low-Current-Density Plating One way to achieve good distribution is the use of a low-current acid copper-plating system, which is designed specifically to produce a deposit with the required physical properties at reduced current density. Some shops are presently plating HDI boards at 6 to 8 ASF for a period of 4 to 6 hours. This will give excellent plating distribution, due to the increased suppression at these low plating voltages. Low-current-density plating baths or electrolytes are characterized by lower copper concentration and increased sulfuric acid concentrations (refer to Table 29.4). The additive package of carrier and brightener is specifically formulated to operate at these low-current densities.

also provided. Figure 19.3 illustrates the prototype board circuit and Figure 19.4 is a photograph of the completed circuit board. The PortD and PortB signals are terminated on 10pin box-header connectors. Users can create their own circuits with matching connectors for connecting peripheral devices. The circuit must be operated at a regulated 5-V power supply. The programmer dongle that connects to the PC through the PC parallel port on one end and the ISP header on the header is illustrated in Figure 19.5. The circuit consists of a 74LS244 buffer, a capacitor, a signal diode 1N4148, and a 100-K resistor. The 244 buffer circuit ensures that the parallel port signals can drive the serial programming signals of the AVR processor in the target circuit of the protoboard. The buffer is used to write and read program memory and EEPROM (as desired) to and from the AVR processor into the PC. Figure 19.6 is a photograph of the dongle circuit board. This dongle and the prototype board use the Atmel AVR ISP software developed by Kanda Systems, and they have very kindly provided a copy of this software to be included on the accompanying CD.

TABLE 29.4 Operation and Control Operating variable plating Copper Copper sulfate Sulfuric acid Chloride Additives Temperature Cathode CD Anodes Type Composition Bags Hooks Length Anode CD Properties Composition Elongation Tensile strength

Precision Manufacture of Spherical and Aspheric Surfaces on Plastics and Glass [12]

Low current density plating 1 2 oz./gal 4 8 oz./gal 25 32 oz./gal 40 80 ppm As required 75 85 F 5 15 ASF Bars or baskets Phosphorized 0.04 0.06% P Closed-napped polypropylene Titanium or Monel 2 in. shorter than rack 25 50% of cathode CD 99.8% (99.5% min., ASTM-E-53) 10 25% (6% min., ASTM-E-8 or ASTM-E-345) 40 50 kpsi (36 kpsi min, ASTM-E-8 or ASTM-E-345)

Conventional CD* plating 2 3 oz./gal 8 12 oz./gal 22 28 oz./gal 40 80 ppm As required 70 85 F 20 40 ASF

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